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“This article will discuss why it is important to use MLPPP for bonding T1 circuits which will be included in an MPLS network.”

The Importance off MLPPP for Bonded T1 MPLS Networks

Written by: Dennis Green - Aug 19, 2008

This article will discuss why it is important to use MLPPP for bonding T1 circuits which will be included in an MPLS network. Multiprotocol-label-switching (MPLS) is a relatively new technology, which has led to major advancements in the convergence of telecommunication networks. With MPLS, one network of a company can now facilitate virtually all needed applications on one bandwidth pipe. For example, one network could carry VoIP (Voice over internet protocol), video conferencing, and all routine data transfer simultaneously. With the use of Quality of Service (QoS), the data packets of each of these applications would be prioritized so that they do not compete, or interfere with each other as they pass through the network. The use of one pipe to accommodate many applications, is commonly referred to as convergence.

One of many advantages of an MPLS based network over networks based on frame relay or point to point circuits, is that MPLS is much more scalable. With MPLS, you can easily scale the bandwidth of each location of your network up from fractional T1, to full T1, to bonded T1, to fractional DS3, to full DS3, and/or on up to OC3, depending on the needs of your company. For small to medium locations, bonded T1 provides a popular bandwidth range. Rather than needing to jump from a T1 to a T3 (the equivalent of 28 T1s), with the use of bonded T1, a company can scale from one T1 (1.54 megabits per second (mbps)), to a dual bonded T1 (3 mbps), triple bonded, and incrementally on up to eight bonded T1s (12 mbps) as bandwidth needs grow.

Bonded T1 is an extremely important aspect of many networks, because of the relative expense of skipping from T1 to T3. T1 and bonded T1 are commonly provided over the same copper wires which provide telephone service. For this reason, in most cases, T1 and bonded T1 can be installed at a business location for free. T3 (DS3) however, requires special wiring. For this reason, it often costs tens of thousands of dollars to provide the wiring to each business location to accommodate a DS3 circuit. Providing this wiring is commonly referred to as build-out. There are almost never build-out charges associated with T1 or bonded T1. Another reason that bonded T1 can be much more efficient in cost, is that in order to provide fractional DS3, virtually the same facilities are needed as would be required for full DS3. For this reason, the monthly cost of fractional DS3 (T3) is not proportional to the cost of full DS3. Because of this, when equivalent bandwidth below 12 mbps is compared, the monthly cost of bonded T1 is far less expensive than fractional DS3.

In the past, to achieve bonded T1, multiple T1s were bonded via load balancing. Load balancing worked great for companies which needed more bandwidth than a single T1 could provide. By bonding T1s, if a company’s need for bandwidth exceeded the capabilities of a single T1, applications would be shared with a second, third or fourth T1. The downside of load balanced bonded T1s however, is that each T1 in a load balanced bonded T1 actually function as separate pipes, rather than all T1s functioning as a single pipe. With load balancing, if one single application needed more bandwidth than a single T1 could accommodate, then major challenges would result. Also, load balancing presented many challenges toward convergence. Many applications could not be efficiently coordinated or prioritized over a load balanced bonded pipe, because with load balancing, bonded T1s actually functioned more like a grouping of single bandwidth pipes.

With the recent introduction of MLPPP technology, T1s can now be bonded, so that all function as a single pipe. With MLPPP, applications no longer need to be divided as evenly as possible across a series of single T1s. MLPPP results in a significant improvement in the ability of MPLS networks to utilize QoS to coordinate and prioritize applications over a single bonded circuit. This advancement provides profound advantages; both financially and functionally, to small and medium sized companies, or large companies with medium sized locations in their network.

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T3-DS3 Definition Continued. T3-DS3 Applications T3 is a relatively large data bandwidth pipe which is commonly used for internet connectivity, voice lines, direct point-to-point connection between two business locations, Multiprotocol Label Switching (MPLS) networking between multiple locations of a business and integrated circuits which combine any combinations of these applications. T3-DS3 Internet A T3 data circuit can support up to 600 internet users, depending on application and simultaneous usage. DS3 is also great for facilitating servers which will allow hundreds of simultaneous users to access information from servers. T3-DS3 Voice A DS3 voice circuit is excellent for large call centers, or for facilitating the telephone needs of hundreds of occupants of an office complex. T3 voice can be provided either as local voice, for local and long distance calling, or as long distance voice, which provides wholesale per minute long distance prices but does not facilitate local calling. Both long distance and local voice can be integrated into one DS3 voice circuit. T3-DS3 Private Point-to-Point DS3 point-to-point circuits are extremely popular for connected two or more business locations. To clarify, with point-to-point a separate circuit is needed for each two locations networked. These circuits can facilitate location to location transfer of large data files, multiple file transfers between hundreds of employees, location-to-location voice traffic and video conferencing. T3-DS3 MPLS Networking DS3 MPLS networks are better suited for networking more than two locations than point-to-point circuits. This is because MPLS facilitates any-to-any location networking rather than requiring a separate circuit for each two locations required by point-to-point networks. Also, with Class of Service (CoS) MPLS can prioritize applications. With CoS, applications such as routine data transfer, voice, and video can be efficiently implemented simultaneously over one bandwidth pipe, without interfering with each other. MPLS is a major advancement when compared networks based on point-to-point or frame relay. T3-DS3 Integrated One T3-DS3 integrated circuit can accommodate all applications mentioned above on one circuit. For example, with an integrated DS3 circuit, local voice, long distance voice, video, internet and networking can all be facilitated on one circuit. T3-DS3 and the Need for Build-Out DS3 requires fiber or other forms of special wiring to reach each business location. This is very important because new customers, or customers considering upgrading from t1, bonded t1, or ethernet over copper, must pay for this wiring (build-out cost) before their building can receive t3 or OC circuits. Buildings which are connected to fiber, and therefore able to receive DS3 are referred to as being “lit”. It is not uncommon for customers to fail to plan for this unexpected upfront cost when planning the installation of DS3. Build-out often costs tens of thousands of dollars. Alternatives to T3-DS3 There are many alternatives for customers who need less or more bandwidth than can be provided by DS3. If a customer needs between 15 mbps and 35 mbps, then fractional T3 is an excellent choice. If 12 mbps or less are needed, then ethernet or bonded t1 are excellent alternatives. It is important to consider these alternatives if less that 45 mbps are needed because bonded t1, and ethernet are delivered over copper phone lines and therefore do not require expensive build-out costs. Often bonded t1 and ethernet are installed for free. If more than 45 mbps is needed, then OC 3 (155 mbps) is a good alternative. Both fractional DS3 and OC circuits require build-out for buildings which are not lit. Ethernet over T3-DS3 Larger ethernet circuits can be delivered over DS3. There are at least three advantages of ethernet over DS3. First, ethernet over DS3 can deliver higher bandwidth than a regular DS3 circuit. Ethernet over DS3 can provide up to 88 mbps. Second, ethernet over DS3 can be less expensive per mbps then DS3. An 88 mbps ethernet over DS3 circuit can often be offered for less than $6000 per circuit. Depending on location, $6000 is the average cost for a 45 mbps DS3 circuit. Third, ethernet over DS3 requires much simpler and less expensive hardware for handoff at the customer premise than does DS3. To check prices and availability for any of the services listed above, please use the pricing tool at the top of this page. Its free, real-time, easy to use and there is no obligation. (Click here to return to top of page)

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T3-DS3

T3-DS3 Applications

T3-DS3 Internet

T3-DS3 Voice

T3-DS3 Private Point-to-Point

T3-DS3 MPLS Networking

T3-DS3 Integrated

T3-DS3 and the Need for Build-Out

Alternatives to T3-DS3

Ethernet over T3-DS3